TING'S QUANTUM ENGINEERS

Quantum Simulation Study • HardHaq 2025

Optimizing ion traps

through simulation.

A comprehensive study simulating and optimizing 3D RF Paul Traps and Surface Ion RF Traps. We analyzed electrode geometry, RF/DC voltages, trap depth, and ion stability to design optimal configurations for quantum computing applications.

What Is an Ion Trap?

An educational introduction to the physics behind ion confinement

Electric Confinement
Electric and RF fields work together to create a potential well that traps charged ions in space.
Quantum Computing
Ion traps are fundamental to quantum computing, providing stable qubits for quantum information processing.
Precision Control
Advanced electrode geometries enable precise manipulation of ion positions and quantum states.
Research Objective

The Task

Understanding and optimizing key performance metrics for ion trap configurations

Objective

Our objective is to design, simulate, and optimize a 3D RF Paul trap and a Surface Ion trap in COMSOL by experimenting with electrode geometry and voltages to understand and improve the electrostatic and pseudopotential landscapes that confine a chain of Yb⁺ ions.

Trap Metrics - How We Measure an Ion Trap
Simulation 1

Traditional 3D RF Paul Trap

Four RF rod electrodes with two DC endcaps, operating in vacuum for Yb⁺ ion trapping

Description

4 RF rod electrodes

2 DC endcaps

Operates in vacuum

Designed for Yb⁺ ion trapping

True 3D quadrupole field

Additional Parameters

Rod radius: 1.000 mm

Rod length: 40.000 mm

Rod spacing: 8.873 mm

RF voltage: 75.000 V

DC voltage: 102.900 V

Endcap radius: 7.200 mm

Endcap thickness: 0.845 mm

Endcap distance from trap center: 0.360 mm

Endcap voltage: 2.500 V

RF drive frequency: 6.400 MHz

Simulation Results

COMSOL Multiphysics 6.3.0 — Global Evaluation Metrics

Trap Depth
11.568 eV
depth_eV
Minimum Potential
72.806 eV
minU_eV
Maximum Potential
84.374 eV
maxU_eV
Trap Position (x, y, z)
-5.0×10-6, -5.0×10-6, 0.01
meters
Offset Distance
10.00 mm
offset_mm
Estimated Power
71.51 mW
P_est_mW

Model: 3d_pole_trap(optimized).mph |Date: Nov 23 2025, 00:05

3D Pole Trap Model

3D Pole Trap Model

Pole Trap Cross Section

Pole Trap Cross Section

Pseudopotential Animation

Pseudopotential Animation

Simulation 2

Surface Ion RF Trap

Microfabricated planar electrode layout with ions floating above the chip surface

Description

Microfabricated planar electrode layout where ions float above the chip surface. More compact but presents unique challenges with shallower trap depths.

Planar electrode geometry

Compact chip-scale design

Scalable for quantum computing

Additional Parameters

Width of center DC electrode: 0.1143 mm

Width of RF electrodes: 0.1929 mm

Spacing of RF electrodes from center: 0.1929 mm

RF voltage: 328.5714 V

DC voltage: 97.1429 V

Endcap radius: 3.0000 mm

Endcap thickness: 0.2000 mm

Endcap distance from trap center: 0.5000 mm

Endcap voltage: 0.1000 V

RF drive frequency: 30.0000 MHz

Total trap length: 1.2143 mm

Challenges

Lower trap depth compared to the Paul trap

Sensitive to stray electric fields

Complex electrode shape constraints

Shaping a field direction to create a low pseudopotential zone for the ions

Optimizations

Electrode Geometry

Width/spacing parameter sweeps for optimal field configuration

RF/DC Ratio Tuning

Balancing confinement strength with stability regions

Pseudopotential Curvature

Improving trap depth through field shape optimization

Micromotion Minimization

Offset tuning to reduce excess ion motion

Simulation Results

COMSOL Multiphysics 6.3.0 — Global Evaluation Metrics

Trap Depth
24.359 eV
depth_eV
2.1× Higher than 3D Trap
Minimum Potential
135.500 eV
minU_eV
Maximum Potential
159.858 eV
maxU_eV
Trap Position (x, y, z)
0, -3.95×10-4, 1.53×10-4
meters
Offset Distance
0.423 mm
offset_mm
Estimated Power
2.19 µW
P_est_mW
32,700× Lower Power

Model: Surface_trap(v4)1.mph |Date: Nov 23 2025, 02:02

3D Surface Trapped Ion Model

3D Surface Trapped Ion Model

Surface Trap Cross Section

Surface Trap Cross Section

Pseudopotential Animation

Pseudopotential Animation

Comparison

A detailed comparison of 3D RF Paul Traps vs. Surface Ion Traps

Category
3D RF Paul Trap
Surface Ion Trap
Geometry
4 RF rods + 2 DC endcaps
Planar microfabricated electrodes
Trap Depth
11.568 eV
24.359 eV (2.1× higher)
Power Consumption
71.51 mW
2.19 µW (32,700× lower)
Trap Offset
10.00 mm
0.423 mm (better centering)
RF Frequency
6.4 MHz
30.0 MHz (4.7× higher)
Fabrication
Complex machining
Microfabrication scalable
Scalability
Limited
Highly scalable
Efficiency Formulas
3D RF Pole Trap
ηpole = 10³ ×ω × ε₀ × π × Lrod × VRFdrod × √2²
Expanded form:
ηpole = 10³ × [η0
where η0 =ω × C × VRF√2
and C =ε₀ × π × Lroddrod
Variables:
ω: RF angular frequency
ε₀: permittivity of free space
Lrod: rod length
drod: rod spacing
VRF: RF voltage
Surface RF Trap
ηsurf = 10³ ×ω × ε₀ × π × wRF × L × VRFdRF × √2²
Expanded form:
ηsurf = 10³ × [η0
where η0 =ω × C × VRF√2
and C =ε₀ × π × wRF × LdRF
Variables:
ω: RF angular frequency
ε₀: permittivity of free space
wRF: RF electrode width
L: trap length
dRF: RF electrode spacing
VRF: RF voltage
Optimization Improvements

Through COMSOL Multiphysics optimization, we achieved remarkable improvements:

  • 3D Trap: 62.9× increase in trap depth (0.184 eV → 11.568 eV)
  • Surface Trap: 20.2× increase in trap depth (1.205 eV → 24.359 eV)
  • Improved field symmetry and reduced offset distances for better ion positioning
Key Insights

Our optimized designs reveal surprising results:

  • Surface traps now achieve 2.1× higher trap depth than 3D traps
  • Surface traps consume 32,700× less power while maintaining superior performance
  • Both designs demonstrate excellent scalability potential for quantum computing

Conclusion

Through advanced simulation and geometric modelling using COMSOL and optimization, Ting's Quantum Engineers developed two validated simulations for ion confinement systems.

Our work enhances the design pipeline for future quantum technologies and experimental physics, providing a robust foundation for next-generation quantum hardware development.

Powered by
TING'S QUANTUM ENGINEERS
References & Sources

Academic papers and resources used in this study